Automated X-ray Inspection System
TI-X900s
The World’s Highest Resolution of 0.16 µm
Hige-end X-ray Inspection System TI-X900s
Features
The TI-X900s contributes to sustainable quality management through its unique and creative hardware and applications, which are based on advanced ideas.
■ High Resolution Imaging
By increasing the resolution compared to the previous model, the TI-X900s achieves higher resolution imaging and is suitable for inspection of cutting-edge semiconductors.
■ High-definition 3D imaging
Clear, high-definition 3D images can be acquired thanks to XY stage positioning by high-precision linear scale.
■ Capable of handling large works
The large table mechanism can accommodate up to 600 x 620 sizes of works, making it easy to observe the area you want to see.
■ Technology to improve the accuracy of automatic inspection.
Equipped with automatic warp compensation and alignment functions that follow the Z-direction, improving inspection accuracy.
Specifications
| Model | TI-X900s | |
|---|---|---|
| Work size | 30 × 30 〜 600 × 620 mm | |
| FOV size | Fluoroscopy : 0.35 × 0.45 mm – 23.0 × 29.4 mm CT : φ 0.32 – 20.5 mm | |
| lnspectable area | Fluoroscopy : 600 × 620 mm CT : 580 × 600 mm | |
| X-ray source | Micro focus spot open tube : Diamond / LaB6 | |
| Detecto | 6.8Mpixels | |
| CT angle | Max. 60 degrees (45 to 60 degrees variable) | |
| geometrical resolution | Fluoroscopy : 0.16 – 10.0 µm CT : 0.16 – 10.0 µm | |
| Image slice number | 512 * Can be increased to 1,000 | |
| CT Scanning | 8 〜 360 shots | |
| X-Y moving part | Linear motor drive, linear scale | |
| Air supply | 0.5 – 0.6Mpa (φ8 tube or 20 PM) | |
| Power voltage | Single-phase AC 200 – 240V ±10%, 50/60Hz | |
| Power Consumption | 10 kVA or less | |
| Environment req. | 22°C ± 2°C, 50% ± 10% RH | |
| X-ray leakage dose | 0.5 μSv/h or less | |
| Footprint | W1,630 × D2,200 × H1,940 mm | |
| Weight | Approximately 4,400 kg | |